Electronic Components & Semiconductor & Electric Circuit Materials

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Double-plated FPC Substrate

Double-plated FPC Substrate, developed by Toray Advanced Film Co., Ltd., is a double-plated FPC substrate with a copper layer formed on polyimide film by a plating method without using adhesives. Features include (1) ultra-thin plated copper layer simplifies fine pitch etching, (2) excellent dimensional stability, (3) outstanding resistance to bending and breaking. Usage in liquid crystal driven COF circuits in PC and mobile telephones in particular is expanding rapidly.

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Toray Advanced Film Co., Ltd.